Dow Corning 340 Heat Sink Compound
Dow Corning® brand thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and hightemperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Electronic devices are continually designed to deliver higher performance. Especially in the area of consumer electronics, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line ®™ Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow. Dow Corning is a registered trademark of Dow Corning Corporation. The Corning portion of the Dow Corning trademark is a trademark of Corning, Incorporated, used under license. We help you invent the future is a trademark of Dow Corning Corporation. 2017, May 30 XIAMETER is a registered trademark of Dow Corning Corporation. Form No. 11-3359B-01 ©2012–2017 Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company. All rights reserved. 2 Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
Description
Dow Corning® brand thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and hightemperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Electronic devices are continually designed to deliver higher performance. Especially in the area of consumer electronics, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line ®™ Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow. Dow Corning is a registered trademark of Dow Corning Corporation. The Corning portion of the Dow Corning trademark is a trademark of Corning, Incorporated, used under license. We help you invent the future is a trademark of Dow Corning Corporation. 2017, May 30 XIAMETER is a registered trademark of Dow Corning Corporation. Form No. 11-3359B-01 ©2012–2017 Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company. All rights reserved. 2 Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
Features & Benefits
Non-flowing
Moderate thermal conductivity
No need for ovens or curing
Heat flow away from electronic components can increase reliability
Compliant with MIL-DTL-47113
Composition
Zinc Oxide
Polydimethylsiloxane
Applications
Dow Corning® 340 Heat Sink Compound is suitable for thermal coupling of electrical/electronic devices to heat sinks.
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