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Specialty heat-transfer-fluids

Galden LS and HS Vapor Phase Soldering Fluids

Galden LS and HS Vapor Phase Soldering Fluids

Galden LS/HS is a line of fully fluorinated fluids specifically designed for the Vapor Phase Soldering process. The narrow molecular weight distribution as well as the very strong carbon-fluorine bond and the flexible ether link provide the properties which make Galden LS/HS ideal for use in VPS.

Features of Galden LS and HS Vapor Phase Soldering Fluids

  • Wide choice of grades with different boiling point
  • Narrow molecular weight distribution
  • Low heat of vaporization Vapor density greater than air
  • Excellent thermal and chemical stability Good compatibility with materials
  • No flash or fire points No auto ignition point No explosion hazards

Benefits of Galden LS and HS Vapor Phase Soldering Fluids 

  • Widest operating temperature range to optimize VPS process
  • Maximum process stability and repeatibility No boiling point drift
  • Rapid and residue free drying Pre-heating and heating processes take place in an inert atmosphere
  • No corrosion or reaction with materials of construction No formation of decomposition residues
  • Enhanced safety Safe to use at high temperature

Lead Free and Vapor Phase Soldering

RoHS (Restriction of Hazardous Substances) is also known as “lead free” but this law deals with other five substances as well:
• Lead
• Mercury
• Cadmium
• Hexavalent Chromium
• Polybrominated biphenyls (PBBs)
• Polybrominated diphenyl ethers (PBBs)

Particular emphasis is being placed on lead; lead is a concern when released to the environment as it can cause damage to the human body, it can also accumulate in the environment and has acute and chronic effects on plants, animals and microorganism.

Because of RoHS, manufacturers of electronic equipment will have to produce and deliver lead-free equipment; one of the first evidence of this has been the development of lead free printed circuit boards (PBCs). Solder traditionally used ~60% of tin (Sn) and ~40% of lead (Pb), now alternative solder materials have been studied, the most common replacements for lead are silver (Ag), Copper (Cu) and Bismuth (Bi). These alternative materials, however, bring a main challenge: higher melting temperature. Traditional tin/lead solders melt at ~180°C while lead free solder melts at ~227°C. Soldering temperatures, as well as heating issues, are ongoing concerns for PCBs assemblers.

Galden LS and HS grades for vapor phase soldering offer the right lead free process solution:

• Galden LS and HS fluids are RoHS compliant and can be sold in Europe
• Galden LS and HS fluids offer the widest temperature range for lead free solders up to 260°C
• Galden LS and HS fluids precise vapor temperatures eliminate overheating

Vapor phase soldering (Typical Properties at 25°C)

LS 200maximum soldering temperature 200°Cfor leaded solder 
LS 210maximum soldering temperature 210°Cfor leaded solder 
LS 215maximum soldering temperature 215°Cfor leaded solder 
LS 230maximum soldering temperature 230°C for unleaded solder (e.g.. SnCuAg) 
XS 235maximum soldering temperature 235°Cfor unleaded solder (e.g.. Sn100C, SnCu) 
HS 240maximum soldering temperature 240°Cfor unleaded solder (e.g. SnCu) 
HS 260maximum soldering temperature 260°Cfor unleaded solder (Special solders) 

Additional fluids for vapor phase soldering and temperature testing are available on request.
The datasheets can be downloaded at:

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